1·The process of flip chip based on aluminum nitride is studied.
研究了以氮化铝为基板的倒扣封装的工艺。
2·Disclosed is a process for producing an ultrafine powder of aluminum nitride.
披露是生产的氮化铝超细粉加工。
3·However, there has not article about direct synthesis of aluminum nitride in high-energy ball mill.
但用高能球磨直接氮化合成氮化铝的方法尚未报道。
4·Aluminum nitride is an important semi conductive material used in the blue and near ultraviolet band.
氮化铝(ain)是一种重要的近紫外、蓝光半导体材料。
5·We obtained rods, flakes, spheres, porous aluminum nitride by control of synthesis conditions, respectively.
实验中通过控制条件得到了棒状、片状、球状和多孔形貌的氮化铝粉末。
6·The method comprises: (1) sintering aluminum nitride ceramic at a low temperature by plasma-discharging sintering;
该方法主要包括三个部分：（1）利用放电等离子 烧结技术实现氮化铝陶瓷的较低温度烧结；
7·Effects on the rheological behavior of slurry for tape-casting aluminum nitride substrate were studied systematically.
系统地研究了流延法制备氮化铝基片过程中影响流延浆料粘度的主要因素。
8·Since coefficients of thermal expansion between aluminum nitride and silicon are near, large thermal stress will not be introduced.
氮化铝的热膨胀系数与硅的十分接近，因此不会引入大的热应力。
9·Instead of a beam, they fashioned a tiny diving board of aluminum nitride plated with aluminum that vibrated by getting thinner and thicker.
研究者们利用一块镀铝的氮化铝微小跳板代替了光束，跳板上的铝层通过变薄和变厚来进行振动。
10·Provided is a method of efficiently and strongly joining ceramics even when they are ceramics of extremely low dielectric loss factor, such as aluminum nitride.
本发明提供即使是像氮化铝那样介质损耗因数极小的陶瓷也高效且牢固地接合的方法。