1·The factors which affect the firing temperature of the glaze were discussed, and the opacifying mechanism of glaze was also approached.
探讨了影响釉烧成温度的诸因素及釉的乳浊机理。
2·To better visualize this correlation, we plotted the characteristic temperatures given in Table 5 on the graphic of sample height versus firing temperature.
为了更好地想象这种比照，本人们采集了由表格五中样本高像素熄灭温度地图像供给特征温度。
3·Firing temperature for the production of special circuits in the internal connection and End Lead, PTC thermistors, and semiconductor ceramic device electrodes.
适用于中温烧成制作特种电路的内部连线及端头引出线，PTC热敏电阻及半导体陶瓷器件电极等。
4·The color glaze of low firing temperature and low expansion coefficient, to match the glaze tile made from common clay, was prepared in lead borosilicate system.
采用铅硼硅熔决釉研制出同时符合普通粘土瓦坯的烧成温度低、热膨胀系数低这两个主要性能特点的釉料。
5·The color glaze of low firing temperature and low expansion coefficient, to match the glaze tile made from common clay, was prepared in lead borosilicate system.
采用铅硼硅系统，研制出具有低烧成温度、低热膨胀系数的色釉，用作粘土釉面瓦釉料，其外观、物理、化学性能均能满足质量要求。
6·The high temperature foamed ceramic produced has low firing temperature, short duration of firing, wide range of firing temperature and easily control production.
研制的高温发泡陶瓷具有烧成温度低、烧成时间短、烧成温度范围宽、易于生产控制的特点。
7·Porcelain: the quality of porcelain has direct relationship with the service life of sits implement. If the firing temperature is higher, the quality of porcelain will be better.
瓷质：瓷质的好坏和马桶的寿命有直接的关系，烧成温度越高，瓷质越好。
8·It is analyzed that Mossbauer parameter variations of clays from the famous sites of ancient kilns change with firing temperature, firing time and firing atmosphere in firing process.
分析了几种著名的古窑遗址粘土烧制过程中穆斯堡尔参数随烧制温度，烧制时间和烧制气氛的变化规律。
9·When spodumene was added in the products, the cause for reducing firing temperature, enhancing mechanical strength and heat-shock resistance, possessing good chemical stability was clarified.
阐明在制品中添加锂辉石，能降低烧成温度，提高机械强度，抗热振性以及具有良好的化学稳定性的原因。
10·Facing main topics are enhancement of dielectric constant of ceramics, decrease of it "s firing temperature. decrease of dielectric layer thickness and keeping reliable contact of electrodes."
提高瓷的介电常数，减小介质层的厚度，保持电极可靠的接触及降低瓷料的焙烧温度是当前的主要研究课题。