1·Plating solution of quantitative supplies.
电镀液的定量补给。
2·Electroplating industry circulation-filtering various plating solution.
电镀业循环过滤各类电镀液。
3·Plating solution surface tension is too large, wetting agents insufficient.
电镀溶液表面张力过大，湿润剂不足。
4·Electrochemical characteristics of the zinc plating solution are also studied.
同时研究了镀锌液的电化学特性。
5·Electroplating, coating metal anode, was oxidized to cationic into plating solution;
电镀时，镀层金属做阳极，被氧化成阳离子进入电镀液；
6·A method for applying an electroless plating solution to a substrate is also provided.
还提供一种将无电电镀液施加至基板上的方法。
7·When to use two kinds of different performance of plating solution, the production very favorable.
当采用两种性能不同的镀液时，对生产十分有利。
8·Naphthol in sulphate plating solution of tin can be straightly determined by absorption spectrophotometry.
用吸光光度法直接测定了硫酸盐镀锡液中2 -萘酚的含量。
9·The chemical precipitation method is feasible for extending the life of electroless nickel plating solution.
采用化学沉淀法延长化学镀镍液寿命是切实可行的。
10·The ways to prevent iron brush plating solution from being oxidized during storage and working are described.
阐述电刷镀铁液贮存期间和刷镀过程中防氧化的方法。
1·When to use two kinds of different performance of plating solution, the production very favorable.
当采用两种性能不同的镀液时，对生产十分有利。
2·The change of the current density of the upper and lower specification limits by plating solution is the nature of concentration, temperature and stirring, factors such as the decision.
电流密度的变化的上限和下限是由电镀液的本性﹐浓度﹐温度和搅拌等因素决定的。
3·Using molecular sieve type plating solution additive is very favorable to raising coat thickness, coat adhesion and its stability.
使用分子筛型镀液添加剂对提高镀层厚度、镀层结合力及其稳定性都非常有利。
4·The weight of copper plating solution in a unit volume was function of contents of cupric pyrophosphate and potassium pyrophosphate.
镀液单位体积的重量是焦磷酸钾和焦磷酸铜含量的函数。
5·Plating solution of quantitative supplies.
电镀液的定量补给。