reflow soldering

回流焊接:一种电子元器件表面贴装技术

常用释义

词性释义

回流焊接:一种电子元器件表面贴装技术,通过将焊料预先涂在电路板上,然后在高温下使其熔化并与元器件连接。
例句
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1·Suitable for and reflow soldering. .
适合于一般焊接及回焊。
2·Available for reflow soldering and wave soldering.
适应再流焊和波峰焊。
3·After reflow soldering rapid cooling should be avoided.
请避免回流焊接后的急速降温。
4·Reflow soldering should not be done more than two times.
回流焊接最多只能进行两次。
5·Please follow "Reflow Soldering Conditions" in catalogue.
请遵守产品目录中的回流焊条件。
6·SMD lamp beads, manufactured through full automatic reflow soldering line.
贴片灯珠,全自动化回流焊生产;
7·Design stencil according to requirement of inserter soldering quality and reflow soldering technology.
根据插件焊接质量的要求,按照回流焊工艺设计印刷模板。
8·In the course of the lead free reflow soldering, lead and lead free of reflow soldering affect the quality of product.
在再流焊无铅化过程中,再流焊的有铅要素与无铅要素的兼容性直接影响产品质量。
9·Flux management systems and methods are provided for filtering vaporized flux from the gas of a reflow soldering oven.
本发明提供一种用来将汽化的焊剂从回流焊接炉的气体中过滤出来的方法和焊剂管理系统。
10·Including optical analyzer, salt spray test machine, infrared reflow soldering, constant temperature oven, current load, etc.
当中包括光普分析仪、盐雾测试机、红外线回流焊、恒温炉、电流负载等设备。