1·Temperature cycling of components.
零件温度循环。
2·Result show that IMC layer increased with the cycles, and it grew faster under low temperature cycling.
结果表明，随着循环周期的增加，界面IMC层的厚度增加，且低温极限温度越低时IMC生长越快。
3·When hydride reorientation takes place, there is a threshold stress concerned with the number of temperature cycling.
随着应力增大和温度循环次数增加，氢化物再取向程度也增大，但是氢化物发生再取向存在应力阈值。
4·To provide the fan installed on the bicycle and its transmission mechanism, used to provide wind and temperature cycling.
提供安装在自行车上的风扇及其传动机构，用于给骑车者提供风力和降温。
5·With continuation of temperature cycling there is a reversible change of the shape(along curve 2) with a very small hysteresis.
在随后的温度循环中， 其形状的变化是可逆的（沿曲线2），滞后效果很小。
6·Furthermore, stress strain distribution in the solder joints has dynamic feature during temperature cycling and is related to temperature history.
在温度历史过程中，应力—应变场等值分布图呈现动态特性，且与温度历史相关。
7·When applied stress is higher than the threshold stress, the level of hydride reorientation increases with the increase of stress and the number of temperature cycling.
当应力大于应力阈值时，氢化物应力再取向程度随着与应力、温度循环次数增加而增大。
8·RDP transducers are subjected to temperature cycling as well as electrical supply cycling, plus shock and vibration testing where application circumstances demand. RDP.
传感器受到温度循环以及供电单车，加上震动和振动测试在应用情况的需求。
9·The output power is very stable after the temperature cycling and vibration test. No apparent power decrease has been observed as the device working continuously for 500 h.
该光纤耦合模块连续工作500小时没有发现明显的功率衰减，并且输出功率经温度循环和振动冲击后具有较好的稳定性。
10·The basic properties of the new alloys shown here were fully characterized and their use in SMT applications evaluated, especially in drop shock and temperature cycling tests.
我们将介绍新合金材料的基本属性以及在表面贴装应用中的验证结果，特别是在跌落冲击和温度循环试验的结果。