1·Tin plating on Solder Tail.
的锡焊尾，电镀。
2·Tin Plating on Solder Tail, Harpoon: Brass.
电镀锡焊尾，鱼叉：黄铜。
3·The mechanism of electroless tin plating was discussed.
对化学镀锡的机理做了探讨。
4·Pretreatment, silver plating, nickel plating and tin plating of chip components.
应用于片式元器件的前处理、镀银、镀镍、镀锡等工艺。
5·Contact plating: Gold plating over Nickel on contact area tin plating on solder tail.
触点电镀：镀镍金的接触面积的锡焊尾电镀。
6·The process of electroless tin plating has wide applications in microelectronic filed.
化学镀锡工艺在微电子行业具有很好的应用前景。
7·The invention relates to a piston ring and a surface spongy tin plating technique thereof.
一种活塞环及其表面松孔镀锡工艺。
8·Understand Tin plating theory and process; understand chemical de-flash theory and process;
了解电镀原理，制程；了解化学去溢料原理，制程。
9·The research tendency and developing prospect of electroless tin plating are also discussed.
同时对化学镀锡的研究方向和发展趋势进行展望。
10·Operating hints and safety requirement of re melting in crystal pattern tin plating were introduced.
介绍了晶纹镀锡中重熔工序的操作要点和安全要求。