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Underfill
英音[ ˈʌndəfɪl ] 美音[ ˈʌndərˌfɪl ]
未充满
常用释义
词性释义
n.
未充满；填充不足
例句
全部
This
makes
complete
sense
,
and
it
is
followed
by a
picture
of
a
modern
chip
with the
bumps
and
underfill
pointed
out
.
这使得完整意义上说，这是其次的图片现代芯片的颠簸和底层指出。
The
results
show
that the
residual
moisture
within
underfill
materials
enhances
the
stress
level
in
solder
joint
.
结果表明：在湿热环境下，底充胶材料内部残留的湿气提高了焊点的应力水平。
Discuss
the
necessary
of
flip
chip
underfill
to ther mal
fatigue
failures
.
Put forward
controlling
parameter
for flip
chip
underfill
.
从热疲劳故障的角度论述了倒装芯片底部填充的必要性，介绍了倒装芯片底部填充的参数控制。
Does
your
SMT
facility
have
underfill
capabilities
?
If
so
,
what
machines
do
they
use
?
贵公司的SMT设施拥有底充胶能力吗？如果有的话，它们采用什么机器？
The
influence
of
underfill
and its
material
models
on
the
reliability
of flip chip package under
thermal
cycling
底充胶及其材料模型对倒装焊热循环可靠性的影响
Thermal conductivity
prediction
of
underfill
and its
affects
on
the flip chip
temperature
field
底充胶导热系数预测及对倒装焊温度场的影响
Influence
of
Cure
-
residual
Stress
on
Underfill
Epoxy
Reliability
in Flip-Chip Assembly Under Thermal Cycling
固化残余应力对倒装焊底充胶可靠性的影响
New
Underfill
Technology
Application
and
Development
最新底部填充技术的应用及发展
Thermal
Cycle
Failure
of SnPb
Solder
Joint for Flip Chip Package
and
Effects
of
Underfill
Material
倒装焊SnPb焊点热循环失效和底充胶的影响
Underfill
Delamination
of Flip Chip
on
Low
-
Cost
Board
低成本基板倒装焊底充胶分层裂缝扩展研究