Electromigration英文翻译_含义_读音_Electromigration例句

词性释义

n.

电迁移

例句

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电迁移

The electromigration of Cd in contaminated kaolin soil by an iron (Fe) and activated char (C) primary cell.

以铁屑和活性炭构建的（原）电池研究不同电极间距下高岭土中的镉在（原）电池电场下的电动力学迁移。

As an electric current passes through, the Joule heating and electromigration effects occur in the flip chip solder bumps.

当电流通过焊点时，会伴随产生焦耳热效应和电迁移效应。

The effects of annealing and nitrogen as a diluting gas on the electromigration resistance of deposited copper film were also investigated.

考察了沉积后退火以及氮气作为稀释气体对沉积的铜薄膜抗电迁移率的影响。

II Abstract The electromigration of solder at solid state was studied in the past, but it was not discussed at liquid state.

I在以往焊锡的电迁移研究中，探讨对象都是固态焊锡，而液态焊锡是未被探讨的。

With higher current and smaller size trends, electromigration in flip-chip solder has become an critical of reliability concern.

伴随积体电路高电流､小尺寸的设计变化，覆晶焊锡接点内的电迁移现象成为元件可靠度的影响关键。

Having 40% lower resistivity than Al and good electromigration resistance, Cu is being considerably studied as candidate of Al.

铜的电阻率比铝低40%，有更好的抗电迁移能力，因而被作为铝的替代材料而受到广泛研究。

In this thesis, we focuse on the microstructure and stress of ULSI Cu interconnects with their impacts on MTF of the electromigration.

本论文主要研究了ULSI中铜互连线的微观结构和应力及其对与电徙动MTF的影响。

Action of electromigration in the charge.

电迁移在充电中的作用。

With the development of large-scale integrated circuits, the reliability caused by electromigration becomes a key issue.

随著大规模集成电路的不断发展，电迁移引起的集成电路可靠性问题日益凸现。

So it is very necessary to study the wettability of lead -free solders and electromigration of solder joints.

因此开展低成本无铅焊料润湿性和焊点电迁移研究非常有必要。

On the diffusion mechanism and Its Differential Equations for the diffusion migration with Electromigration

关于扩散迁移与电致迁移共同作用时的扩散机制及微分方程

Electromigration reliability diagnosis and clock signal integrity analysis using electrothermal simulations

基于电热模拟的电迁移可靠性诊断及时钟完整性分析

Characterization of Al Via Electromigration in VLSI Interconnection and Its Reliability Research

互连铝通孔电迁移特征及其可靠性研究

An investigation of high temperature and constant current electromigration reliability assessment technique

高温恒定电流电迁移可靠性试验及结果分析

Investigation of Indicator Parameters of Electromigration in Very Large Scale Intergration Interconnects

超大规模集成电路金属互连线的电迁移过程指示参量研究

Quantitative study on the electromigration dispersion in capillary zone electrophoresis

毛细管电泳电迁移扩散的定量研究

Research and Development of the Cu Interconnect and Its Electromigration Failure

铜互连电迁移失效的研究与进展

Numerical Calculation of Electromigration Under Pulse Current with Joule Heating

考虑焦耳热的脉冲直流下电迁移数值计算

Test Methods for Electromigration in IC Interconnects and Their Evaluations

集成电路互连线电迁移测试方法与评价

Electromigration in Al interconnects and the challenges in ultra-deep submicron technology

铝互连线的电迁移问题及超深亚微米技术下的挑战

1·Electromigration in metal thin film interconnection is one of the important problems for VLSI reliability.

金属薄膜互连的电迁移现象是VLSI最重要的可靠性问题之一。

2·Therefore, the reasons and the influencing factors of IR-drop and electromigration are discussed firstly.

针对这个问题，本文首先介绍了IR压降和电迁移现象的产生原因及其影响因素。

3·Electromigration is the movement of metal atoms in the direction of current flow.

电迁移是金属原子沿着电流方向的移动。