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solderable
英音[ ˈsɒldərəbl ] 美音[ ˈsɑːldərəbəl ]
可软焊的
常用释义
词性释义
adj.
可软焊的
例句
全部
A
uniform
,
compact
,
bright
and
excellent
solderable
coating
with
good
adhesion
was
obtained
by
the
experimental
electroplating
.
经小槽电镀，获得外观致密均匀、似镜面光亮、结合力强、具有优良的可焊性镀层。
The bath components and the
operating
conditions
for
a
new
electroplating
technology
of
solderable
bright
Sn
-
Bi
alloy
were
studied
.
研究了一种可焊性光亮锡铋合金电镀工艺的镀液配方和电镀操作条件；
Electroless
nickel
under
immersion
gold
(
ENIG
)
provides a
solderable
coating
,
but
is
expensive
.
浸金下无电镀镍（ENIG）涂层可以提高可焊性，但此方法比较昂贵。
Develop
:
The
unexposed
PISM
is
developed
away
,
leaving the
solderable
pads
exposed
.
显影：未曝光的部分阻焊膜显影时除去，已曝光部分留存。
Specifications
for
particular types
of
winding
wires
-
Solderable
polyurethane
enamelled
round
copper
wire
,
class
155
,
with
a
bonding
layer
特种绕组线规范.155级带粘结层的可焊接聚氨酯漆包圆铜线
Electroplating
processes
of
solderable
coatings
from
methanesulfonate
bath
甲基磺酸盐镀液体系可焊性合金镀层的工艺
Surfaces
of
dense
ceramic
components
for
electrical engineering
;
testing
of hard-solderable
metal
coatings
电工细陶瓷件的表面.可硬钎焊金属镀层的试验
Surfaces
of
dense
ceramic
components
for
electrical engineering
;
testing
of soft-solderable
metal
coatings
电工细陶瓷件的表面.可软钎焊金属镀层的试验
Specifications
for
particular
types of
winding
wires
-
Solderable
polyurethane
enamelled
round
copper
wire
,
class
155
特种绕组线规范.155级可焊接聚氨酯漆包圆铜线
Specifications
for
particular
types
of
winding
wires
-
Solderable
polyurethane
enamelled
round
copper
wire
,
class
180
绕组线特殊类型规范.可焊接的聚氨酯漆包圆铜线.180级
Standard Test
Method
for
Measuring
Adhesion
Strength
of
Solderable
Films
to
Substrates
测量可焊膜与基片的粘结强度的方法
Specifications
for
particular
types of
winding
wires
-
Solderable
polyesterimide
enamelled
round
copper
wire
,
class
180
特种绕组线规范.180级可焊接聚酰胺酯漆包圆铜线
Specifications
for
particular
types of
winding
wires
-
Part
51:
Solderable
polyurethane
enamelled
round
copper
wire
,
class
180
特种绕组线规范。第51部分：钎焊聚氨酯漆包圆铜线180级
Review
and
Prospect
of
Solderable
Tin
-
Based
Binary
Alloy
Plating
可焊性锡基二元合金镀层研究的现状与展望
Research
and
Progress
of
Lead
-
free
Solderable
Tin
-Based
Coating
无铅可焊性锡基镀层的研究与发展
Developing
Status
of
Solderable
Sn
Alloy
Plating
电镀可焊性锡合金工艺的发展现状
Specifications
for
particular types
of
winding
wires
-
Part
20:
Solderable
polyurethane
enamelled
round
copper
wire
,
class
155
;
Amendment
2
特种绕组线规范。第20部分：可焊接的聚氨基甲酸乙酯漆包圆铜绕组线，155级。修改件2
Review
of
tin
and
solderable
tin
alloy
electroplating
电镀锡和可焊性锡合金发展概况
Progress
of
research
on
electroless
plating
of
solderable
tin
alloy
化学镀可焊性锡基合金的研究进展
Talk
on
Plating
Process
of
Solderable
Bright
Sn
-
Ce
Alloy
浅谈可焊性光亮锡铈合金电镀工艺