1·Boffins were busily filling in the blanks in the periodic table and probing unknown atomic phenomena (like radioactivity and bonding).
科学家们忙于填补元素周期表的空白、探索未知的原子现象(如放射性和键合)。
2·Four fundamental manufacturing technologies namely bulk micromachining, surface micromachining, moulding and wefar bonding are introduced for Micro Electro Mechanical System(MEMS).
介绍了微电子机械系统的四种基本制作技术，即本体微机械加工、表面微机械加工、铸模工艺和晶片键合工艺。
3·Three typical manifestations of wafer bonding strength were introduced as tensile strength, shear strength and adhesive strength.
介绍了三种典型的圆片键合强度表现形式：抗拉强度、剪切强度和粘接强度。
4·That BP network used for predicting quality of wire bonding is feasible and valid.
BP网络用于金丝键合质量的预报具有可行性和有效性。
5·The hot embossing and bonding machines have been used practically in microfluidic chip automatic fabrication, and the chips have satisfactory quality, precision, repetition and consistency.
塑料微流控芯片热压键合设备已经投入自动化生产，生产的芯片质量、精度、重复性和一致性良好。
1·Our understanding of planet formation suggested that precious metals such as gold and tungsten should have moved into Earth's iron core long ago, due to the affinity they have for bonding with iron.
我们对地球形成的理解认为如黄金和钨等贵金属在很久以前因它们与铁粘合的吸引力而移到了地球的铁核心。令人惊讶的是，在地球表面和下面的地幔层里贵金属反而比较丰富。
2·The scans of the long-in-love also showed activity in brain regions associated with attachment, liking and bonding.
对于长久爱情的扫描结果表明它与依恋、爱好和粘合程度相关。
3·The scans of the long-in-love also showed activity in brain regions associated with attachment, liking and bonding.
对于长久爱情的扫描结果表明它与依恋、爱好和粘合程度相关。
4·Activate the bonding section of the windscreen.
对风挡的粘合部分进行活化处理。
5·The consequences of this passivity of the anode are that the next most anodic item within the anode bonding system will start to sacrifice itself which could of course be very serious.
阳极这种钝性的后果就是阳极粘合系统中接下去大多数的阳极项目都会开始消耗自己，这当然是很严重的。
1·And step six asks us, well, do we have any bonding electrons left?
而第六步问我们，好，我们还有成键电子剩下吗？
2·So, bonding orbitals are down here.
所以成键轨道在下面。
3·Whereas if the phases where mismatched, you would not get bonding.
如果两个相位不相符合，就不能成键。
4·Remember, that's going to become important when we talk about bonding, we don't need to worry about it too much right now.
记住，这在我们讨论到，成键的时候很重要，现在你们还不用太多的考虑它。
5·And obviously, no bond is the weakest of all is not bonding.
显然，没成键是最弱的。
1·The viscoelasticity and viscoplasticity of bonding material will result in hysteresis and drift errors to sensor output.
黏合材料的黏弹性和黏塑性将会导致传感器输出的滞后和漂移误差。
2·The process of FPC mount is fixing the components to FPC, by means of adhesive bonding, welding, etc.
FPC贴装过程就是通过胶剂黏合或焊接等方法，将元器件固定到FPC上的过程。