1·Water vapor aging test whether experiment: discoloration or corrosion, and the subsequent spots solderability.
水蒸气老化实验：测试是否变色或腐蚀斑点，及后续的可焊性。
2·And other manufacturing technologies-interconnect between the chip and microstrip, manufacture of microstrip, solderability of available materials and soldering process are discussed.
同时研究了芯片与微带线间距的互连、微带线制作、材料的可焊性及焊接过程等制造技术。
3·Because of the special alloy coatings has the properties and the application at the special requirements, can be divided into the wear resistance, solderability, magnetic and bearing alloy etc.
由于合金镀层具有的特殊性能及使用上的特殊要求，可分为耐磨性、可焊性、磁性及轴承合金等。
4·The non-bright tin deposit has good solderability after sealing.
封闭后的雾面锡镀层仍有良好的可焊性。
5·The environment of storage can affect the solderability of surface.
存储环境对表面的可焊性有影响。