debonding
英音[ diːˈbɒndɪŋ ] 美音[ diˈbɑːndɪŋ ]

剥离

常用释义

词性释义

n.

剥离,脱胶;舒解
例句
  • 全部
  • 剥离
  • 脱胶
After total fiber break occurs, interfacial debonding starts, causing a very large portion of strain energy to be released.
Debonding was detected for hot water immersions.
1·In this paper, a group of new models and the formulas for calculating the debonding strength of interface are presented based on the predictions of a mesoscale finite element model.
本文根据作者提出的细观单元有限元研究的结果,建议了一组新的界面本构模型以及界面剥离强度计算公式。
2·The FRP-to-concrete interfacial debonding is a fundamental key problem for the strengthening of RC structures with externally bonded FRP.
粘贴FRP加固混凝土结构的界面剥离问题是FRP加固混凝土结构技术的关键基础问题。
3·FRP (fibre reinforced polymer) debonding is one of the major failure modes for reinforced concrete beams shear-strengthened with external FRP strips.
FRP剥离是外贴frp抗剪加固混凝土梁主要的破坏模式之一。
4·The debonding failure models of RC beam strengthened with FRP are theoretically analyzed. It is pointed out that interface shear stress concentration is the main cause to lead to debonding failure.
对纤维布加固混凝土梁发生粘结剥离破坏进行了理论分析,发现其破坏原因主要是界面间产生应力集中;
5·According to different failure mechanism and displaying part, the failure modes are divided into plate end debonding failure and intermediate crack induced interfacial debonding failure.
这种粘结破坏按形成机理及破坏部位的不同可分为板端剥离破坏和跨中受弯裂缝导致的粘结破坏。
1·In the paper, a slice composition-energy method was presented for analysis of debonding problem of honeycomb sandwich plates.
本文提出了分析蜂窝夹芯板脱胶问题的片条合成-能量法。
网络释义

剥离

的替代品使用,如此即可省略剥离 (Debonding)、打线接合 (Wire-bonding)、注型等制程。 ※COB (Chip On Board) : 一种不需 …

脱粘

34 (2)脱粘Debonding 复合材料在纤维脱粘后产生了新的表面,因此需要能量。尽 管单位面积的表面能很小,但所有脱 …

脱胶

空客飞机民航英语_百度文库 ... lightning strike 雷击, debonding 脱胶, distortion 扭曲, ...

剥离制程

...减少晶圆的厚度是一种可降低硅中介层成本的方法,但在剥离制程Debonding)后,厚度较薄的晶粒则在机械性稳定度、应 …

界面脱离

化工和机械英文字典 - - 中国氟塑料论坛... ... 界面态 interface state 界面脱离 debonding 界面温度 interfacial temperature ...

粘结破坏

...化时,两种材料不会产生过大的变形差而导致两者间的 粘结破坏(Debonding)。

去粘结

在线英语词典,英文翻译,科技词典,专业词典,在... ... 721 私立: Private 722 去粘结debonding 723 颈环: cervical-loop ...

去暂时性键合

TSIA 台湾半导体产业协会 ...  暂时性键合( Temporary Bonding)  去暂时性键合( Debonding)  挖孔( Via Formation) ...
同义词
n.
剥离,脱胶;舒解
更新时间:2025-05-12 00:56